For ordinary users, up to upgrade Asus M50s or very convenient, the main products back baffle fixed by screws, fixed buckle is not much, we only need to unscrew the screw, can be easily taken down baffle, replacement of internal hardware.
The other main hardware Asus M50s were concentrated on the other a big baffle, from the picture below, we can see that this part is mainly composed of memory, processor, Beiqiao chip, wireless network card, video card and the heat dissipation module.
Next let us have a look the radiating module M50s. The radiating part of this product is mainly composed of a fan, the metal fin heat pipe, copper and aluminum heat sinks. One copper heat pipe for processor and Beiqiao chip cooling, the metal fins, a fan removal of heat from the cooling hole on the left side of the host.
The processor cooling, is responsible for the graphics part of heat and a heat pipes.
Graphics card cooling module
We put the heat dissipation module M50s removed, we can see that it has two main parts processing unit and display unit, processor unit is connected with fan, and graphics unit mainly passive cooling, with the help of the processor unit fan effect, the heat discharge.
The radiating module
Now more and more strong performance of mobile graphics card, memory particles high natural little also not conductive silicone auxiliary heat.
After removing the battery , the first memory and hard drive cover removed.
Then the hard disk can be directly removed, there is no obstacle.
Remove the hard drive, like CD-ROM , memory and wifi card after the next face of all the screws are screwed down to D , as shown in Figure.
Then flip to the C side , pry the keyboard on top of the plastic strip , revealing three keyboard screws , screw off after , you can pry the keyboard.
The back of the keyboard has a cable connected to the motherboard.
Keyboard is removed after the C fixed screw all bare, as shown in figure, all removed.
C and D the surface casing can be easily separated, here there are two lines, disconnect. C surface casing back, ABS engineering plastic material, with a metal shield layer.
After C is removed, the internal structure of L600-01B take in everything in a glance, the board surface is covered with an insulating layer.
After turning over, visible radiator , HM55 chip is directly exposed , not arranged cooling measures.
The first step to remove the drive and battery.
Unscrew the figure hit the red circle of four screws
Unscrew the four screws , the hard drive and MINIWIFI to glance the outside hard shell wrapped in protective plastic , the following is WIFI , and a B -band.
The protective plastic case to win, look all around shockproof sponge.
This set off a bus, I saw the motherboard, now I still don’t understand why such a design, originally thought it was what special plug type interfaces, a motherboard, after watching what also have no, think carefully about the possible disk space is too small fever two such design can be directly with the heat dissipation holes pre without any isolation, and cooling, but the huge quantity of heat during the actual use of the hard disk, no less than the IBM T2X series of left hand drag temperature, even higher.
Falling Figure 7 screw in the circular, attention to the length of points. If to replace memory in the future as long as the spin 3 Red Ring screws.
Put the computer to turn to the front and then a finger pressing the F9 key, there’s a gap, with screwdriver gently pry it up with plastic striped lever down.
Gently lifted the keyboard, the keyboard isn’t as good as T2X interface, but with the line connection, so it is not difficult to get off, the red circle in the graph is the keyboard interface.
Between the panel and see, the picture that piece of big thermal conductivity of aluminum foil is shouldering the keyboard and CPU.